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Thermal Conductivity of Building Materials

TE-105

Thermal insulation in building planning is a sub-area of construction physics; it uses appropriate measures such as component design to enable a comfortable room climate all year-round while at the same time-consuming little energy. This is achieved by using building materials with high thermal resistance and low transmission by heat radiation.

The TE 105 device is used to investigate various non-metallic building materials with regard to their thermal conductivity in accordance with DIN 52612. The scope of delivery includes samples made of different materials: insulating panels made of Armaflex, chipboard, PMMA (acrylic glass), Styrofoam, Polystyrene-PS, Polyoxymethylene-POM, cork and plaster. The samples all have the same dimensions and are placed between a heated plate and a water-cooled plate. A clamping device ensures reproducible contact pressure and heat contact.

The hot plate is heated by an electric heating mat. In the cold plate, the temperature is achieved by water cooling. Sensors measure the temperatures at the cooling water inlet and outlet and in the center of both plates.

The temperatures for the hot plate above the sample and for the cold plate underneath the sample are set using the software provided. A temperature control system ensures constant temperatures.

The heat flux between the hot plate and the cold plate passes through the sample and is measured by a special heat flux sensor. The entire housing, including the cover, is thermally insulated to ensure constant ambient conditions.

The measured values are transmitted directly to a PC via USB where they can be analyzed using the software included.

Specifications

  1. Heat conduction coefficients of different non-metallic insulation materials should be calculated with the training set.
  2. With the device, the thermal conductivity coefficient of at least 8 different materials must be calculated.
  3. Armaflex chipboard, PMMA (acrylic glass), Styrofoam, Polystyrene-PS, Polyoxymethylene-POM, cork and plaster.
  4. Samples must all have the same dimensions
  5. The samples should be placed between a heated plate and a water-cooled plate.
  6. There should be a locking mechanism to keep the samples under pressure.
  7. The hot plate must be heated with an electric heating mat.
  8. In the cold plate, the temperature reduction should be achieved by water cooling.
  9. The sensors must be able to measure the temperatures at the coolant inlet and outlet and at the center of both plates.
  10. 1 resistance should be used as a heating element in the device.
  11. Resistance power should be 500 W.
  12. Temperature limitation: 80°C
  13. The thickness of the sample plates should be 50 mm maximum.
  14. Plate dimensions should be: 300×300 mm.
  15. When the common heat conduction coefficient of more than one sample is desired to be determined, the thickness should not exceed 50 mm.
  16. DAQ system will be available
  17. Easy to use and WINDOWS 10 compatible user interface program

Measuring ranges:

  • Temperature: 3x 0… 100 ° C, 2x (0 … 200oC)
  • Heat flux density: 0 … 1550 W / m2
  • Electrical requirements for the device: 230V, 50Hz, 1 phase
  • The devices should be delivered fully assembled tested and ready to operate.

Experiments

  • Determination of thermal conductivity of different materials.
  • Determination of thermal resistance.
  • Determination of common thermal conductivity of multiple materials in series.